Wan Yu LED products are born of our especial new packaging technology.
For high power LED, if adopting traditional packaging technology,due to poor heat dissipation, the quick rise of chip temperature ( its thermal resisitance up to 150℃-250℃) and the carbonization and yellowing of epoxy material will happen, which leads to accelerated light attenuation and breakdown by stress generated in rapid thermal expansion.New packaging structure with low thermal resistance,good heat dissipation.
It uses special materials with low thermal resistance and good heat dissipation to bond the chip,and adopts semi encapsulation structure for accelerated heat dissipation.For lowering the thermal resistance,double heat dissipation mechanism is applied.High transparency soft silicon filled inside the LED will cause neither LED breakdown nor yellowing due to sudden changes of the temperature.Besides,heat conduction and dissipation features of the component material are considered for a good overall.
Our especial packing technology makes perfect use of the expansion coefficient and optical properties of silicon and designs close bonding of epitaxy and silicon,which improves the luminous efficiency of high power LED by 15% and remarkably lowers the defect rate in packaging process. Through the application of unique packaging materials and structure to effectively conduct and dissipate the heat generated at the chip,our packaging technology perfectly solves the bottleneck problem of heat dissipation in LED lighting.
1. Excellent and fast chip heat dissipation
3. Low chip temperature,only 3 ℃~5℃ higher than working environment temperature,ensuring exceptionally long chip life-span
4. Wide light emitting angle(120 °) and perfect uniformity
5. Mininum light attenuation in longtime use
For high power LED, if adopting traditional packaging technology,due to poor heat dissipation, the quick rise of chip temperature ( its thermal resisitance up to 150℃-250℃) and the carbonization and yellowing of epoxy material will happen, which leads to accelerated light attenuation and breakdown by stress generated in rapid thermal expansion.New packaging structure with low thermal resistance,good heat dissipation.
It uses special materials with low thermal resistance and good heat dissipation to bond the chip,and adopts semi encapsulation structure for accelerated heat dissipation.For lowering the thermal resistance,double heat dissipation mechanism is applied.High transparency soft silicon filled inside the LED will cause neither LED breakdown nor yellowing due to sudden changes of the temperature.Besides,heat conduction and dissipation features of the component material are considered for a good overall.
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