New especial LED packing technology
* Wan Yu Package uses leading edge technology for high efficiency,high brightness,and high reliability.
LED strengths summary
* Wan Yu chip technology:
Wan Yu creative design
One of the lowest Vf in the world is realized with leading edge thermal design
* Wan Yu creative technology of "Sub-mount" structure in the LED package:
1) Light emitting efficiency improvement
2) Minimum heat returning to the LED chip
3) Heat dissipation performance improvement
* Sub-mount moudule is best for Multi-chip LED package.
High luminous efficiency chip(1)
advanced thermal design technology
High luminous efficiency chip(2)
adcanced thermal design technology
* Temperature elevation at the P/N junction can be minimized with the structure of light emitting layer formed on the copper alloy substrate having 380W/mK in the thermal conduction coefficient ( generally 150W/mK)
* As a result,remarkable improvement of conversion rate from electric energy to light, highest level brightness, and the lowest level Vf in the world are realized
* Wan Yu uses the non-sapphire based LED dice which is brighter,and the statistic electricity charge of copper ally substrate may not be caused
Silicon Sub-mount(1)
What is silicon sub-mount module
Silicon Sub-mount(2)
effective heat dissipation
Silicon Sub-mount(3)
Mirror finish surface
Silicon Sub-mount(4)
Minimum heat returning to chip
Silicon Sub-mount(5)
the silicon sub-mount module is best for multi-chip led package
* Wan Yu Package uses leading edge technology for high efficiency,high brightness,and high reliability.
LED strengths summary
* Wan Yu chip technology:
Wan Yu creative design
One of the lowest Vf in the world is realized with leading edge thermal design
* Wan Yu creative technology of "Sub-mount" structure in the LED package:
1) Light emitting efficiency improvement
2) Minimum heat returning to the LED chip
3) Heat dissipation performance improvement
* Sub-mount moudule is best for Multi-chip LED package.
High luminous efficiency chip(1)
advanced thermal design technology
High luminous efficiency chip(2)
adcanced thermal design technology
* Temperature elevation at the P/N junction can be minimized with the structure of light emitting layer formed on the copper alloy substrate having 380W/mK in the thermal conduction coefficient ( generally 150W/mK)
* As a result,remarkable improvement of conversion rate from electric energy to light, highest level brightness, and the lowest level Vf in the world are realized
* Wan Yu uses the non-sapphire based LED dice which is brighter,and the statistic electricity charge of copper ally substrate may not be caused
Silicon Sub-mount(1)
What is silicon sub-mount module
effective heat dissipation
Silicon Sub-mount(3)
Mirror finish surface
Minimum heat returning to chip
the silicon sub-mount module is best for multi-chip led package
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